Are you struggling with the heat resistance of components? Adhesive materials that can cure at low temperatures.
Shortening the curing process! Achieving application to materials with low heat resistance and suppression of warping and deformation due to thermal stress. Epoxy-based thermosetting adhesives and sealants.
★Are you facing any of the following issues? 〇 Want to bond low heat-resistant parts at a low curing temperature 〇 Want to relieve stress caused by heat 〇 Want to achieve snap curing inline 'Plain Set' is a one-component epoxy resin adhesive developed based on the technology of latent curing agents that our company has accumulated over the years. It is utilized in various fields such as precision electronic components like camera modules, semiconductor mounting, communication components, and car electronics. We offer a lineup of products with unique features, including: "Flexible Type" "Gas Barrier Type" "UV and Heat Combined Type" "Conductive Type," among others, with their respective characteristics available in the catalog. 【Features】 ■ Suitable for assembling electronic components that include heat-sensitive materials due to its low-temperature curing capability of below 80°C ■ Can cure in just a few seconds at low temperatures of 120°C and 150°C ■ With a low thermal history, it alleviates stress caused by material contraction during cooling, suppressing warping and deformation *For more details, please refer to the PDF materials or feel free to contact us. Also, please visit our company website at the URL below.
- Company：味の素ファインテクノ
- Price：Other
